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Reliability Physics and Engineering: Time-To-Failure Modeling

Reliability Physics and Engineering: Time-To-Failure Modeling

Reliability Physics and Engineering: Time-To-Failure Modeling
By J. W. McPherson

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(8 customer reviews)

Book Description

"Reliability Physics and Engineering" provides critically important information for designing and building reliable cost-effective products. The textbook contains numerous example problems with solutions. Included at the end of each chapter are exercise problems and answers. "Reliability Physics and Engineering" is a useful resource for students, engineers, and materials scientists.


Book Details

  • Amazon Sales Rank: #504694 in Books
  • Brand: J W Mcpherson
  • Published on: 2013-06-04
  • Original language: English
  • Number of items: 1
  • Dimensions: 9.49" h x 1.09" w x 6.30" l, 1.62 pounds
  • Binding: Hardcover
  • 399 pages

Features

  • Reliability Physics and Engineering Time To Failure Modeling

Editorial Reviews

From the Back Cover

Reliability Physics and Engineering provides critically important information that is needed for designing and building reliable cost-effective products.

Key features include: 

·       Materials/Device Degradation

·       Degradation Kinetics

·       Time-To-Failure Modeling

·       Statistical Tools

·       Failure-Rate Modeling

·       Accelerated Testing

·       Ramp-To-Failure Testing

·       Important Failure Mechanisms for Integrated Circuits

·       Important Failure Mechanisms for  Mechanical Components

·       Conversion of Dynamic  Stresses into Static Equivalents

·       Small Design Changes Producing Major Reliability Improvements

·       Screening Methods

·       Heat Generation and Dissipation

·       Sampling Plans and Confidence Intervals

This textbook includes numerous example problems with solutions. Also, exercise problems along with the answers are included at the end of each chapter.

Reliability Physics and Engineering can be a very useful resource for students, engineers, and materials scientists.

About the Author
Dr. J.W. McPherson is at McPherson Reliability Consulting, LLC.


Customer Reviews

Most helpful customer reviews

3 of 3 people found the following review helpful.
5Reliability at Its Best
By Zoltan Ring
Author Joe W. McPherson received his Ph. D. degree in physics from Florida State University; and he has been with Texas Instruments since 1980. He is now Texas Instruments Senior Fellow Emeritus. He has 150 publications in the field of semiconductor reliability. He applies science to reliability problems to solve them.

Throughout the book, the author tries to give examples for reliability issues for pipes, tires, turbine blades, but without question, the primary thrust of the book is semiconductor reliability. The chapters deal with device degradation and fitting degradation data; statistics (Normal, Lognormal and Weibull distribution); failure rate; accelerated degradation and modeling, ramp to failure test, and TTF models for semiconductor circuits (this being the condensed version of Dr. McPherson's work), mechanical reliability issues and conversion of dynamic stress into static equivalent.

There are plenty of examples (with realistic experimental data) in each chapter to illustrate how to fit data, how to construct the statistics and calculate statistical variables; how to accelerate degradation and to project to use conditions for exponential and power law models; analytical formulas for ramp testing establishing effective time at fail stress level for exponential and power law models. TTF models for semiconductor circuits chapter include electron and stress migration and their relation to grain boundaries and conductor geometries; corrosion and exponential corrosion model with RH%; thermal cycling and associated crack propagation - plastic deformation and corresponding Cofin-Manson model; Time-Dependent Dielectric Breakdown (TDDB) - E, 1/E and 1/SQRT(E) models are discussed and compared for lifetime projections; Mobile Surface Inversion, Hot Carrier Injection and Negative Bias Instability are also discussed. Mechanical reliability issues - most with semiconductor reliability issues in mind - are discussed in a separate chapter: bonds and Mie-Gruneisen potential, ionic bonds, elastic and inelastic behavior of metals, grain boundaries, fracture strength, creep and fatigue.

The book has a laser focus and clarity and does not degenerate into abstract academic discussions other than what is necessary for understanding issues at hand. The reader can follow up with the references and McPherson's publications - which have the same clarity and notation system that the book does. I highly recommend the book especially for those with a generic engineering background who deal with reliability - for them the book is going to be an eye opener.

1 of 1 people found the following review helpful.
5Excellent book as I had gained a lot of knowledge ...
By Thomas Pastore
Excellent book as I had gained a lot of knowledge from it, although there could be improvements. Overall this is the best book I have found on reliability since Dr. McPherson gives examples showing you how to work reliability problems followed by problems with answers. In contrast, other books just give problems without answers. I found the book somewhat easy to follow; but it may be difficult for some new students to follow.

1 of 1 people found the following review helpful.
5probably the best around. Probability and statistics coverage is not his ...
By R. McNally
In terms of tutorial on the physics/kinetics of failure, Joe's book is top notch, probably the best around. Probability and statistics coverage is not his strongest point overall. For that scope I would recommend Tobias and Trindade or Meeker. Meeker in particular is the benchmark on statistics for reliability.

See all 8 customer reviews...
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